Angstrom Level Smoothing

The NanoAccel process has been applied to a variety of optical materials to provide angstrom level smoothing of starting materials with a Ra of <500nm. Materials processed include Silicon Carbide, Silica, Aluminum, Zinc Sulfide, Germanium, Calcium Fluoride, MgF2, SiC, BK7, and Polycrystalline Diamond.

Atomic force microscope (AFM) images of industry standard polished materials versus NanoAccel treated samples are compared below.

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Removal of nano-scale scratches, pits, asperities, and subsurface damage

NanoAccel is a dry-no-touch process that through its mechanism of action removes nano-scale asperities, pits, polishing scratches, and contaminates, and eliminates subsurface damage. AFM images demonstrate surface scatches, pits and asperities on substrate prior to processing as compared to material surfaces post processing.

Atomic force microscope (AFM) images are compared below.

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In a study performed in coorporation with SEMATECH, Exogenesis performed surface exposure of EUV Lithography mask blanks with pit defects. An abstract entitled Mitigation of EUV Mask Blank Substrate Pit and Scratch Defects by Accelerated Neutral Atom Beam (ANAB) Processing was accepted and presented at the 2014 SPIE Advances Lithography Conference (see slide below).

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